Why Choose MHNV AI tracking board?

1.The only Cameralink + SDI dual-input AI tracker in its class

Most AI tracking modules force you to choose one camera interface. MHNV®️ Trac-H-DX-30 takes both — letting you build cross-modal systems

(e.g. machine-vision telephoto + drone EO chain) on a single PCB. No external capture card, no FPGA bridge, no latency stack-up.

2.Mil-grade environmental envelope without losing AI horsepower

Many "rugged" modules sacrifice compute to hit wide-temp specs. The MHNV Trac-H-DX-30 keeps the full RK3588 6 TOPS NPU —same AI as our flagship Trac-S063M — while extending operating range to −40 ~ +65 °C and adding reinforced EMI

shielding. No de-rating. No silicon swap. Suitable for arctic, desert and high-EMI vehicle/aircraft platforms.

3.A pre-engineered family — interface-customizable in days, not months

Trac-H057 is the most-shipped variant of a 7-SKU platform. If your camera uses MIPI, dual SDI, Sony LVDS or pure

Cameralink, we already have a board for that. Same software stack, same SDK, same NPU. Custommechanical adapters, connector pinouts and firmware skinning available on request.

The MHNV®️ Trac-H057 is the flagship of a 7-SKU platform. Same RK3588 6 TOPS AI core, same SDK, same firmware lineage. We pick the interface combination that matches your camera. All 7 variants ship from the same factory; lead time and MOQ are identical.

✅ Firmware skinning (your logo, your OSD, your protocol)

✅ Connector pinout mapping to your harness

✅ Mechanical adapter / mounting bracket

✅ Sensor driver porting (Sony / OV / GalaxyCore / FLIR / GuideIR)

✅ Custom AI model integration (YOLO / RT-DETR / proprietary weights)

✅ Branded packaging & private-label OEM

✅ MOQ from 1 unit for engineering samples; volume pricing from 10 units

FAQ — AI Video Tracking Board

Q1: What is the difference between Trac-H-DX-30, Trac-H-DX-30 and Trac-H-SD-30 Trac-S-MP-20?

All three use the same Rockchip RK3588 with 6 TOPS NPU and deliver 60 Hz tracking with 64 multi-targets. The difference is interface and environmental rating: Trac-H-DX-30 has Cameralink + SDI dual input and wide-temp −40~+65 °C with EMI shielding. Trac-H-SD-30 swaps the Cameralink for a second SDI (best for dual-SDI EO+IR fusion).

Trac-S-MP-20 is the commercial sibling — MIPI input with IP/RTSP output, smaller (55×40 mm) and cheaper, but limited to −20~+60 °C without EMI hardening.

Q2: Can I use my own AI model on the Trac-H-DX-30?

Yes. The RK3588 NPU runs models converted to RKNN format (we provide the toolchain). YOLOv5/v8, RT-DETR,MobileNet variants and many proprietary detectors are supported. Our application team can port your PyTorch /ONNX model on request.

Q3: Does the Trac-H-DX-30 work with thermal cameras?

Yes — via the SDI input (most thermal cores expose SDI) or with the Trac-H-LV-30 variant for direct Sony LVDS thermal cores (FCB-EV, FLIR Boson, GuideIR, etc.).

Q4: What is the minimum order quantity?

MOQ is 1 unit for evaluation of any variant. Volume pricing kicks in at 10 units. Lead time for stock variants is 7–14 days; custom firmware adds 2–3 weeks.

Q5: Is the Trac-H-DX-30 export-controlled?

The board is a commercial AI vision module. It is exported worldwide except to embargoed jurisdictions. Contact us for regional shipping confirmation.

Q6: What software / SDK is included?

A Linux BSP, the RKNN runtime, MHNV's tracking SDK (C/C++ + Python bindings), example applications and a Windows-side debug tool. Source-level licensing available for OEM integrators.

Q7: How does Trac MH-H-DX-30 compare to NVIDIA Jetson Orin Nano?

Trac MH-H-DX-30 is a purpose-built tracking board with integrated video capture (Cameralink + SDI), tracking firmware ready out of the box, and a hardened −40~+65 °C envelope. Jetson Orin Nano is a general-purpose AI dev kit requiring a capture daughterboard, custom carrier, and software development. For closed-loop tracking on a drone or gimbal, Trac-H-DX-30 is faster to integrate and lower BOM.